Dual-Interface Full Metal Card

– Layer Structure:Full SUS

– Surface Texture & Treatment:
Front Side : Electrophoresis or Plating + Inlet + CNC (“VSS”)
Back Side : DDP

– Total Weight: 24.5g

– Reading Direction: Bidirection

– Reading Distance: ＞3cm

– Chip: Infineon SECORA™ Pay (Coil-On-Module). Others on request